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The following page content corresponds to the products formerly marketed by NEC Electronics

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PRESS RELEASES (Company,Management)

PRESS RELEASES (Company,Management)
16 Mar 2010	NEC Electronics and Renesas Announce the New Organizational Structure and Personnel Changes Following Merger
1 Feb 2010	NEC Electronics and Renesas Announce the New Executive Team Following Merger
27 Jan 2010	NEC Electronics Reports Financial Results for the Third Quarter Ended December 31, 2009
24 Dec 2009	NEC Electronics to Change Accounting Principles for Consolidated Financial Statements
24 Dec 2009	NEC Electronics Revises Full-Year Forecasts In Accordance with Change in Accounting Principles
24 Dec 2009	NEC Electronics Reports Quarterly Financial Results for the First Quarter Ended June 30, 2009 and the Second Quarter Ended September 30, 2009 Prepared in Accordance with Japanese GAAP
15 Dec 2009	NEC Electronics and Renesas Sign Merger Agreement
10 Dec 2009	NEC and NEC Electronics Develop High Threshold Voltage Control Gallium Nitride (GaN) Power Transistor on a Silicon (Si) Substrate
10 Dec 2009	NEC Electronics Announces Development of a New Low-Resistance Cu Interconnects Technology for High-Frequency Operations in Low-Power 40nm CMOS Devices
9 Nov 2009	Notice Concerning Capital Injection Changes For the NEC Electronics and Renesas Business Integration
28 Oct 2009	NEC Electronics Reports Financial Results for the Second Quarter Ended September 30, 2009
28 Oct 2009	NEC Electronics Realigns Manufacturing Operations to Enhance Competitiveness
28 Oct 2009	NEC Electronics Revises First Half and Full-Year Forecasts
30 Sep 2009	NEC Electronics Releases New Corporate Social Responsibility and Environment Report 2009
16 Sep 2009	NEC Electronics and Renesas Reach a Definitive Agreement on Business Integration
26 Aug 2009	NEC Electronics and Renesas Report the Progress on Business Integration
29 July 2009	NEC Electronics Reports Financial Results for the First Quarter Ended June 30, 2009
28 July 2009	NEC Electronics and Renesas Report the Progress of Business Integration
25 June 2009	NEC Electronics Announces Executive Personnel Changes
18 June 2009	NEC Electronics Develops New Architecture for Miniaturized Analog Circuit with High Accuracy
18 June 2009	NEC Electronics and Toshiba Extend Chip Technology Development Agreements with IBM
4 June 2009	NEC Electronics Announces Development of a New Selective-Metal-Cap Structure on the Low-Power Cu Interconnects
11 May 2009	NEC Electronics Reports Financial Results for the Year Ended March 31, 2009
11 May 2009	NEC Electronics Announces New President and Chief Executive Officer and Executive Personnel Changes
7 May 2009	NEC Electronics Revises Forecasts for the Fiscal Year Ended March 31, 2009
27 Apr 2009	NEC Electronics and Renesas to Integrate Business Operations - Establishment of the World's Third Largest Semiconductor Company -
20 Apr 2009	NEC Electronics Introduces Next-Generation V850E2M Dual Core Architecture For 32-Bit V850 Microcontrollers
29 Jan 2009	NEC Electronics Reports Financial Results for the Third Quarter Ended December 31, 2008
29 Jan 2009	NEC Electronics Revises Forecasts for the Fiscal Year Ending March 31, 2009
29 Jan 2009	NEC Electronics Announces Measures to Reduce Fixed Costs by 80 Billion Yen over the next Two Years
19 Nov 2008	NEC Electronics Releases SoC Optimized for Stream Processing
29 Oct 2008	NEC Electronics Reports Financial Results for the Second Quarter Ended September 30, 2008
21 Oct 2008	NEC Electronics Revises First Half and Full-Year Forecasts
11 Sep 2008	IBM and NEC Electronics Sign Agreement for Joint Development of Next-Generation Semiconductor Process Technology
30 July 2008	NEC Electronics Reports Financial Results for the First Quarter Ended June 30, 2008
20 June 2008	NEC Electronics and Elpida Agree to Establish Joint Venture in Display Driver ICs
13 June 2008	Reduction of Vth Variation by Work Function Optimization for 45-nm Node SRAM Cell
11 June 2008	A New Low Cost Metal-Gate CMOS Transistor Technology
11 June 2008	A New "Direct Low-k/Cu Dual-Damascene Contact lines" is developed first time in the world for Leading-edge LSI, boosting up performance of CMOS devices by lowering the contact resistance and the parasitic capacitance especially for 45nm-node and beyond.
29 May 2008	NEC Electronics has developed on-chip high-k MIM capacitor to enhance decoupling of power-line noises in leading edge LSIs
29 May 2008	NEC Electronics Announces SoC with 90-nm eDRAM for Mobile VGA Graphics Applications
28 May 2008	Super-reliable Cu interconnects with Low-resistivity by New Ruthenium (Ru) barrier-metal structure for dependable LSI systems
15 May 2008	NEC Electronics Joins the United Nations Global Compact
14 May 2008	NEC Electronics Reports Financial Results for the Year Ended March 31, 2008
14 May 2008	NEC Electronics Announces New Technology to Boost Low Resolution in Images and Video
14 May 2008	NEC Electronics Announces Executive Personnel Changes
18 Apr 2008	NEC Electronics Revises Forecasts for the Fiscal Year Ended March 31, 2008
25 Mar 2008	NEC Electronics Announces Executive Personnel Changes
11 Mar 2008	NEC Electronics Announces Results of Enhanced Early Retirement Plan
3 Mar 2008	Outline of New Companies Established as a Result of Reorganization of NEC Electronics' Subsidiaries
3 Mar 2008	NEC Electronics Announces New Names for Subsidiaries
15 Feb 2008	NEC Electronics Announces Enhancement of Early Retirement Plan
13 Feb 2008	NEC Electronics Establishes Indian Liaison Office in Bangalore
6 Feb 2008	NEC and NEC Electronics Successfully Develop Reconfigurable Analog Baseband LSI for Software Defined Radio
28 Jan 2008	NEC Electronics Reports Financial Results for the Period Ended December 31, 2007
3 Dec 2007	NEC Electronics Announces New Managing Director for Subsidiary in Korea
28 Nov 2007	NEC Electronics Realigns Development and Manufacturing Operations
27 Nov 2007	Toshiba and NEC Electronics Announce Joint Development of 32-nanometer System LSI Process Technology
19 Nov 2007	NEC Electronics Introduces 40-nanometer Embedded DRAM (eDRAM) Technologies
16 Nov 2007	NEC Yamagata to Begin 40-nanometer Manufacturing
14 Nov 2007	Notice Concerning 32-Nanometer Joint Development
13 Nov 2007	NEC Electronics Reports Financial Results for the Six Months Ended September 30, 2007
7 Nov 2007	NEC Electronics Revises Forecasts for the First Half of the Fiscal Year
1 Nov 2007	Notice Concerning the NEC Electronics' Shares Lifted from Grace Period for Delisting
18 Sep 2007	NEC Electronics Introduces On-chip ESD Protection for 45-nm High-speed Communications ICs
18 Sep 2007	NEC Electronics Announces On-chip ESD Protection for the 45-nm Node
31 Aug 2007	NEC Electronics Announces Dissolution of a Subsidiary
30 July 2007	NEC Electronics Reports Financial Results for the First Quarter Ended June 30, 2007
30 July 2007	NEC Electronics Announces Dissolution of a Subsidiary
10 July 2007	Notice Concerning the Ratio of NEC Electronics' Shares Held by the "Special Few"
27 June 2007	NEC Electronics Announces Executive Personnel Changes
14 May 2007	NEC Electronics Reports Financial Results for the Year Ended March 31, 2007
14 May 2007	NEC Electronics Announces Executive Personnel Changes
26 Mar 2007	Leading Optical Chip and Module Manufacturers Target 40 Gbit/s Solution with an Optical Device (XLMD) MSA
22 Mar 2007	NEC Electronics Announces Executive Personnel Change
6 Mar 2007	Kaoru Tosaka, Former President and CEO of NEC Electronics, Passed Away
22 Feb 2007	NEC Electronics Announces New Management Policies
22 Feb 2007	NEC Electronics Revises Full-Year Forecasts
13 Feb 2007	NEC Develops Technology that Enables Observation of Internal Operating Margins in Advanced LSI Devices
13 Feb 2007	NEC Develops Fundamental LSI Technology that Enables Continuous LSI Operation during Logic Circuit Failure
25 Jan 2007	NEC Electronics Reports Financial Results for the Period Ended December 31, 2006
26 Dec 2006	Memorandum of Agreement for Cooperation of Photomask Business
21 Dec 2006	NEC Electronics Reports Stock-based Compensation Plans for the Six Months Ended September 30, 2006
14 Dec 2006	Toshiba, Sony and NEC Electronics Unveil Mass Production Platform Technology for 45nm Generation High Performance System LSI
11 Dec 2006	NEC and NEC Electronics Develop World's First 32nm-Node Multi-Layer Interconnect
11 Dec 2006	Stacked Memory Packaging Technology Takes Mobile Memory Design to New Level
11 Dec 2006	NEC Electronics Announces Development of Novel Resistivity Measurement Technique for High Reliability in Automotive Applications in the 32-nm Node and Beyond
30 Nov 2006	NEC Electronics' New Multifab^TM Strategy Ensures Continuous
25 Oct 2006	NEC Electronics Reports Financial Results for the Six Months Ended September 30, 2006
25 Oct 2006	NEC Electronics Revises Full-Year Forecasts
27 Sep 2006	NEC Electronics Announces Merger of a Subsidiary
27 Sep 2006	NEC Electronics Announces Executive Personnel Changes
12 Sep 2006	NEC Electronics Introduces Industry's First Ultra-Low-Power 55-nanometer Embedded DRAM Technology
4 Sep 2006	NEC Electronics Establishes Subsidiary in Korea
29 Aug 2006	NEC Electronics Announces Executive Personnel Changes
21 Aug 2006	New Joint Venture "Adcore-Tech" Established to Develop Communications Platform for Mobile Handsets for the 3rd Generation (3G/3.5G) and Beyond
4 Aug 2006	NEC Electronics announces expansion of its Singapore manufacturing operations at NEC Semiconductors Singapore's 30th Anniversary
31 July 2006	NEC Develops Novel Design Method for Large Scale and High Speed LSI with More than 50 Million Transistors
27 July 2006	New Joint Venture to Develop Communications Platform for Mobile Handsets for the 3rd Generation (3G/3.5G) and Beyond
26 July 2006	NEC Electronics reports financial results for the first quarter ended June 30, 2006
13 July 2006	NEC Electronics Announces the Amount of Assets to be Contributed upon Exercise of the Stock Acquisition Rights for Stock Option
27 June 2006	NEC Electronics Corporation to Grant Stock Acquisition Rights for Stock Option
20 June 2006	High-k CMOS Technology Delivers Both Low Standby Power Consumption and High Operating Speeds
20 June 2006	High-Speed and Low-Power Operation of 45nm CMOS LSIs with High Performance Interconnects
19 June 2006	Nintendo's New Wii^TM Video Game Console Uses NEC Electronics' Embedded DRAM
13 June 2006	Fujitsu, NEC Electronics, Renesas, and Toshiba to Aim for Standardization of Semiconductor Process Technology for Next-Generation LSI
28 Apr 2006	CORRECTION: NEC Electronics Announces Proposed Reduction in Capital Reserve
25 Apr 2006	NEC Electronics Reports Financial Results for the Fiscal Year and Fourth Quarter Ended March 31, 2006
25 Apr 2006	NEC Electronics Announces Proposed Reduction in Capital Reserve
25 Apr 2006	NEC Electronics Announces Executive Personnel Changes
21 Apr 2006	NEC Electronics Announces Revised Full-Year Forecast Due to Recording of Valuation Allowance Against Deferred Tax Assets
12 Apr 2006	NEC Electronics Receives Intel's Prestigious Supplier Continuous Quality Improvement Award
23 Mar 2006	NEC Electronics Announces Executive Personnel Changes
22 Feb 2006	NEC Electronics Unveils Strategy to Expand Automotive Microcontroller Business
8 Feb 2006	NEC Electronics Introduces New Motor Control Microcontrollers
8 Feb 2006	Development of Technology that Achieves World's Most Accurate On-Chip Measurement of Clock Signal Quality
1 Feb 2006	NEC Electronics, Sony, and Toshiba Announce Joint Development of 45-nanometer System LSI Process Technologies
25 Jan 2006	NEC Electronics Reports Financial Results for the Period Ended December 31, 2005
25 Jan 2006	NEC Electronics Announces Merger of a Subsidiary
7 Dec 2005	NEC and NEC Electronics Introduce New 45nm-node LSI Interconnect Technology for Reliability and Low-Power Consumption
7 Dec 2005	NEC Electronics and NEC Announce Design Sequence to Optimize Multi-level Interconnects for 45-nanometer Applications
21 Nov 2005	NEC Electronics Unveils New Management Policies
9 Nov 2005	Toshiba and NEC Electronics to Collaborate on 45-nanometer System LSI Process Technologies
26 Oct 2005	NEC Electronics Announces New President and Chief Executive Officer
26 Oct 2005	NEC Electronics Reports Financial Results for the Six Months Ended September 30, 2005
26 Oct 2005	NEC Electronics Announces Revised Full-Year Forecasts
26 Oct 2005	NEC Electronics Announces Revised Dividend Forecasts
27 Sep 2005	NEC Electronics Announces Executive Personnel Changes
2 Sep 2005	NEC Electronics Announces Revised Dividend Forecasts
27 July 2005	NEC Electronics Reports Financial Results for the First Quarter Ended June 30, 2005
6 July 2005	NEC Electronics Announces Forecast of First Quarter Financial Results and Revisions to Interim and Full-Year Forecasts
1 July 2005	NEC Electronics Realigns Sales and Development Operations in China
24 June 2005	NEC Electronics Announces Executive Personnel Changes
20 June 2005	NEC Electronics and NEC Unveil New Breathrough Technologies to Dramatically Reduce Power Consumption of System LSI Devices at 65nm and Below
15 June 2005	NEC, NEC Electronics, & MIRAI Project Succeed in Development of Novel Low-k Film Compatible with 45nm-node LSI Interconnects Using New Concept
27 May 2005	NEC Yamagata Celebrates Launch of 300-millimeter Wafer Production Line
26 Apr 2005	Microsoft Deploys NEC Electronics' Embedded DRAM Technology in Its Next Generation Xbox Platform
26 Apr 2005	NEC Electronics Announces Executive Personnel Changes
26 Apr 2005	NEC Electronics Reports Results for the Fiscal Year and Fourth Quarter Ended March 31, 2005
28 Mar 2005	NEC Kyushu Plants 12,000 Trees in "Environmental Forest"
25 Mar 2005	NEC Electronics Announces Executive Personnel Changes
25 Mar 2005	NEC Electronics America Appoints New President and Chief Executive Officer
7 Mar 2005	NEC Electronics Unveils 90-Nanometer Embedded DRAM Technology
8 Feb 2005	12 Gigabit-Per-Second, Ultra-High-Speed Interface Technology for System LSI Chips Enables Up to Four Times Faster Transmission Rates
26 Jan 2005	NEC Electronics Reports Results for the Three Months Ended December 31, 2004
7 Jan 2005	NEC Electronics Announces Forecast of Business Results for the Three Months Ended December 31, 2004
8 Nov 2004	NEC Electronics Establishes System Software Development Operations Unit
27 Oct 2004	NEC Electronics Reports Results for the Six Months Ended September 30, 2004
15 Oct 2004	NEC Electronics Names New Managing Directors for NEC Electronics Hong Kong and NEC Electronics Singapore
8 Oct 2004	NEC Electronics Announces Forecast of Business Results
1 Oct 2004	NEC Electronics Reorganizes Semiconductor Assembly and Testing Operations
27 July 2004	NEC Electronics Reports Results for the First Fiscal Quarter Ended June 30, 2004
7 July 2004	Changes in NEC Electronics' Board of Directors and Board of Corporate Auditors
2 July 2004	NEC Electronics Announces Establishment of New Subsidiary, NEC Fabserve
7 June 2004	NEC's Software Verification System Cuts System LSI Development Time & Cost Substantially
27 Apr 2004	NEC Electronics Reports Results for the Fiscal Year and Fourth Quarter Ended March 31, 2004
27 Apr 2004	NEC Electronics Announces Executive Personnel Changes
27 Apr 2004	NEC Electronics Announces Corporate Reorganization
5 Apr 2004	NEC Electronics Announces Construction of New Factory Building at NEC Yamagata
1 Apr 2004	NEC Electronics Announces Establishment of New Subsidiary and Integration of Two Assembly and Testing Subsidiaries
25 Mar 2004	Transmeta and NEC Electronics Reach Agreement on Strategic Alliance for Low Power and Leakage Management
3 Feb 2004	NEC Electronics Announces Reorganization of Semiconductor Assembly and Testing Structure
3 Feb 2004	ASE to Acquire IC Packaging and Testing Operation from NEC Electronics
27 Jan 2004	NEC Electronics Announces Combined Financial Results for the Third Quarter of the Fiscal Year Ending March 31, 2004
18 Dec 2003	NEC Acquires Beijing Design Company, Beijing Hua Hong NEC IC Design
6 Nov 2003	NEC Electronics and NEC Yamagata to Construct 300-Milimeter Wafer Production Line
22 Oct 2003	NEC Electronics Announces Combined Financial Results for the First Half of the Fiscal Year Ending March 31, 2004
21 Oct 2003	NEC Electronics and Synplicity Expand Structured ASIC Agreement
16 Oct 2003	NEC Electronics Announces the Exercise Price of the Stock Acquisition Rights for Stock Option
30 Sep 2003	NEC Electronics to Grant Stock Acquisition Rights for Stock Option
30 Sep 2003	NEC Electronics Announces Executive Personnel Changes
31 July 2003	NEC Electronics Announces Combined Financial Results for the First Quarter of the Fiscal Year Ending March 31, 2004
24 July 2003	NEC Electronics Announces IPO on TSE
14 July 2003	NEC Electronics Determined Offering Price and Sales Price, Number of Shares to Be Offered in and Outside Japan, and Number of Shares to Be Sold as Over-Allotment
30 June 2003	NEC Electronics Determined Issue Price of New Shares and Tentative Price Range for Book Building
16 June 2003	NEC Electronics Approved Issue of New Shares and Sale of Existing Shares
13 June 2003	NEC Electronics Corporation Appoints New Corporate Auditor
11 June 2003	NEC Electronics Provides Highly Accurate Copper-Interconnect Modeling Methodology
6 Jan 2003	NEC Micro Systems to Announce New President
1 Nov 2002	NEC Electronics Corporation Commences Operation
1 Nov 2002	NEC Electronics Corporation Announces Executive Personnel Changes

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